1/4 rev. b structure silicon monolithi c integrated circuit product series single-phase full-wa ve motor driver for fan motor type ? features pre-driver compatible for external tr speed controllable by dc/pwm input pwm soft switching drive built-in speed control circuit by rotation speed feedback absolute maximum ratings parameter symbol limit unit supply voltage vcc 20 v power dissipation pd 874.7 mw operating temperature topr -40 to +100 c storage temperature tstg -55 to +150 c high side output voltage voh 36 v low side output voltage vol 15 v low side output current iol 10 ma fg output current ifg 10 ma fg output voltage vfg 20 v ref current ability iref 12 ma hb current ability ihb 12 ma input voltage (h+, h-, cs, pwmin) vin 7 v ict and shift current ability iin 100 a junction temperature tjmax 150 c reduce by 7.0mw/c over ta=25c. (on 70.0mm 70.0mm 1.6mm glass epoxy board) this product is not designed for production against radioactive rays.
2/4 rev. b operating conditions parameter symbol limit unit operating supply voltage range vcc 5.0 to 17.0 v input voltage range 1 (h+, h-) vin1 0 to vcc-2.0 v 0 to 7.0 v input voltage range 2 (pwmin) vin2 0 to vref v 0 to 6.5 v input voltage range 3 (min) vin3 0 to vref v input voltage range 4 (fil) vin4 0 to vfilh v electrical characteristics (unless ot herwise specified ta=25c, vcc=12v) parameter symbol limit unit conditions min. typ. max. circuit current icc 3.0 5.4 8.0 ma hall input hysteresis vhys 5 10 15 mv high side output current ih 5.0 10.5 17.0 ma voh=12v high side output leak current ihl - - 10 a voh=36v low side output high voltage vlh 9.3 9.5 - v iol=-5ma low side output low voltage vll - 0.5 0.7 v iol=5ma lock detection on time ton 0.18 0.3 0.42 s lock detection off time toff 3.6 6.0 8.4 s fg output low voltage vfgl - - 0.3 v ifg=5ma fg output leak current ifgl - - 10 a vfg=17v osc low voltage voscl 0.8 1.0 1.2 v osc high voltage vosch 2.3 2.5 2.7 v osc charge current icosc -50 -32 -20 a osc discharge current idosc 20 32 50 a ref voltage vref 4.6 5.0 5.4 v iref=-2ma hall bias voltage vhb 1.3 1.5 1.7 v ihb=-2ma current limit voltage vcl 130 160 190 mv min bias current imin - - 1.0 a vmin=0v cs bias current ics - - 1.0 a vcs=0v pwmin bias current ipwm 15 25 35 a vpwmin=0v pwmin input high voltage vpwmh 2.3 - 6.5 v pwmin input low voltage vpwml 0.0 - 1.0 v fil output high voltage vfilh 1.3 1.5 1.7 v vpwmin=0v fil source current ifilh -25 -15 -10 a vpwmin=0v fil sink current ifill 10 15 25 a vpwmin=vref vcont charge current icvcon -145 -100 -60 a vcont discharge current idvcon 7 11 16 a vcont charge/discharge current ratio rvcon 9.8 10.1 10.4 - rvcon= (icvcon+idvcon)/idvcon soft start time tss 1.2 2.0 2.8 s less than vcc=9.0v more than vcc=9.0v less than vcc=7.0v more than vcc=7.0v
3/4 rev. b package outlines block diagram terminal name pin no. terminal name 1 gnd 2 shift 3 ict 4 osc 5 min 6 vcont 7 ref 8 vcc 9 a1h 10 a1l 11 a2l 12 a2h 13 cs 14 h+ 15 hb 16 h- 17 cp 18 fil 19 pwmin 20 fg ssop-c20 (unit:mm) d6726 lot no. soft switch 3 vcl hall comp ref ict 4 5 6 8 9 10 18 17 16 15 14 13 11 7 12 osc min vcont ref vc c a1h a1l a 2l a 2h cs h+ hb h- cp fil soft start hb tsd lock protection pwmcomp + - - + current limit comp + - pre driver quick start 1 gnd 2 20 19 shift pwmin fg osc speed control control logic signal output
4/4 rev. b cautions on use 1) absolute maximum ratings an excess in the absolute maximum rations, such as supply volt age, temperature range of operati ng conditions, etc., can break d own the devices, thus making impossible to ident ify breaking mode, such as a short circui t or an open circuit. if any over rated va lues will expect to exceed the absolute maximu m ratings, consider adding circuit protection devices, such as fuses. 2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. 3) power supply line back electromotive force causes regenerated cu rrent to power supply line, therefore take a measure such as placing a capacitor between power supply and gnd for routing regenerated current. and fully ensure that the capacitor characteristics have no probl em before determine a capacitor value. (when a pplying electrolytic capacitors, capacitanc e characteristic values are reduced at lo w temperatures) 4) gnd potential it is possible that the motor output terminal may deflect below gnd terminal because of influence by back electromotive force o f motor. the potential of gnd terminal must be minimum potential in all operating conditions, except that the levels of the motor output s terminals are under gnd level by the back electromotive force of the motor coil. also ensure that all terminals except gnd and motor output terminals do not fall below gnd voltage including transient characteristics. malfuncti on may possibly occur depending on use condition, environment, and property of indi vidual motor. please make fully confirma tion that no problem is found on operation of ic. 5) thermal design use a thermal design that allows for a sufficient margin in li ght of the power dissipation (pd) in actual operating conditions. 6) inter-pin shorts and mounting errors use caution when positioning the ic for m ounting on printed circuit boards. the ic may be damaged if there is any connection er ror or if pins are shorted together. 7) actions in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic field as doing so may cause the ic to malfunction. 8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum rations or aso. 9) thermal shut down circuit the ic incorporates a built-in thermal shutdown circuit (tsd ci rcuit). operation temperature is 175c (typ.) and has a hysteres is width of 25c (typ.). when ic chip temperature rises and tsd circuit works, the output terminal becom es an open state. tsd circuit is designed only to shut the ic off to prevent thermal runaway. it is not designed to protect the ic or guarantee its operation. d o not continue to use the ic after operation this circuit or use the ic in an environment wh ere the operation of this circuit is assu med. 10) testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. alwa ys discharge capacitors after each process or st ep. always turn the ic?s power supply off before connecting it to or removing it f rom a jig or fixture during the inspection process. ground the ic during assembly steps as an ant istatic measure. use similar precaution when transporting or storing the ic. 11) gnd wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a si ngle ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by larg e currents do not cause v ariations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 12) capacitor between output and gnd when a large capacitor is connected between output and gnd, if vcc is shorted with 0v or gnd for some cause, it is possible tha t the current charged in the capacitor may flow into the output resulting in destruction. keep the capacitor between output and gnd b elow 100uf. 13) ic terminal input when vcc voltage is not applied to ic, do not apply voltage to ea ch input terminal. when voltage above vcc or below gnd is appl ied to the input terminal, parasitic element is actuated due to the structure of ic. operat ion of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. do not use in a manner where parasi tic element is actuated.
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